naSRPS EN 50310:2017/A2:2024

Telecommunications bonding networks for buildings and other structures

Scope

This document specifies requirements and provides recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information or telecommunications technology equipment is intended to be installed in order to:
a) minimise the d.c. and a.c. potential differences in order to reduce the risk of malfunction of that equipment and interconnecting cabling due to electromagnetic disturbance;
b) provide the telecommunications installation with a reliable signal reference – which may improve immunity from electromagnetic interference (EMI).
The requirements of this European Standard are applicable to the buildings and other structures within premises addressed by EN 50174-2 (e.g. residential, office, industrial and data centres) but information given in this European Standard may be of assistance for other types of buildings and structures.
NOTE Telecommunications centres (operator buildings) are addressed by ETSI/EN 300 253.
This European Standard does not apply to power supply distribution of voltages over AC 1 000 V.
Electromagnetic compatibility (EMC) requirements and safety requirements for power supply installation are outside the scope of this European Standard and are covered by other standards and regulations. However, information given in this European Standard may be of assistance in meeting the requirements of these standards and regulations.