Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
WITHDRAWN
SRPS EN 60749-39:2008
95.99
Withdrawal of Standard
Jan 30, 2026
PUBLISHED
SRPS EN IEC 60749-39:2022