Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
WITHDRAWN
SRPS EN 60749-21:2008
95.99
Withdrawal of Standard
Aug 29, 2014
PUBLISHED
SRPS EN 60749-21:2013