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SRPS EN 60749-34:2008

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

Sep 9, 2008
95.99   Withdrawal of Standard   Feb 28, 2014

General information

95.99     Feb 28, 2014

ISS

N022

European Norm

31.080  

English  

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Scope

Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.

Life cycle

NOW

WITHDRAWN
SRPS EN 60749-34:2008
95.99 Withdrawal of Standard
Feb 28, 2014

REVISED BY

PUBLISHED
SRPS EN 60749-34:2013

Related project

Adopted from EN 60749-34:2004