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SRPS EN 60749-22:2008

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Oct 9, 2008

General information

60.60     Oct 9, 2008

ISS

N022

European Norm

31.080.01  

English  

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Published

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Scope

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

Life cycle

NOW

PUBLISHED
SRPS EN 60749-22:2008
60.60 Standard published
Oct 9, 2008

Related project

Adopted from EN 60749-22:2003