0 Items
My account
Phone: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Standards sales: prodaja@iss.rs Education: iss-edukacija@iss.rs Information about standards: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Main menu

SRPS EN 60749-14:2008

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Oct 9, 2008

General information

60.60     Oct 9, 2008

ISS

N022

European Norm

31.080.01  

English  

Buying

Published

Language in which you want to receive the document.

Scope

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Life cycle

NOW

PUBLISHED
SRPS EN 60749-14:2008
60.60 Standard published
Oct 9, 2008

Related project

Adopted from EN 60749-14:2003