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SRPS EN 60749-25:2008

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Oct 9, 2008

General information

90.93     Dec 15, 2025

90.00    Dec 15, 2030

ISS

N022

European Norm

31.080.01  

English  

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Scope

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Life cycle

NOW

PUBLISHED
SRPS EN 60749-25:2008
90.93 Standard confirmed
Dec 15, 2025

Related project

Adopted from EN 60749-25:2003