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SRPS EN 60749-19:2008

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

Oct 9, 2008

General information

90.60    

ISS

N022

European Norm

31.080.01  

English  

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Scope

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

Life cycle

NOW

PUBLISHED
SRPS EN 60749-19:2008
90.60 Close of review

Related project

Adopted from EN 60749-19:2003