Phone: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Standards sales: prodaja@iss.rs Education: iss-edukacija@iss.rs Information about standards: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Main menu

SRPS EN 60749-15:2008

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Oct 9, 2008
95.99   Withdrawal of Standard   Feb 28, 2014

General information

95.99     Feb 28, 2014

ISS

N022

European Norm

31.080.01  

English  

Buying

Withdrawn

Language in which you want to receive the document.

Scope

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Life cycle

NOW

WITHDRAWN
SRPS EN 60749-15:2008
95.99 Withdrawal of Standard
Feb 28, 2014

REVISED BY

WITHDRAWN
SRPS EN 60749-15:2013

Related project

Adopted from EN 60749-15:2003