Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
WITHDRAWN
SRPS EN 60749-15:2008
95.99
Withdrawal of Standard
Feb 28, 2014
WITHDRAWN
SRPS EN 60749-15:2013