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SRPS EN 60191-6-6:2008

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Dec 29, 2008

General information

60.60     Dec 29, 2008

ISS

N022

European Norm

31.080.01  

English  

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Scope

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Life cycle

NOW

PUBLISHED
SRPS EN 60191-6-6:2008
60.60 Standard published
Dec 29, 2008

Related project

Adopted from EN 60191-6-6:2001