Withdrawn
Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.
WITHDRAWN
SRPS EN 60749-3:2008
95.99
Withdrawal of Standard
Nov 30, 2020
PUBLISHED
SRPS EN 60749-3:2017