Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.
WITHDRAWN
SRPS IEC 60863:1998
WITHDRAWN
SRPS EN 61709:2009
95.99
Withdrawal of Standard
Oct 26, 2012
WITHDRAWN
SRPS EN 61709:2012