Withdrawn
Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive.
WITHDRAWN
SRPS EN 60749-9:2009
95.99
Withdrawal of Standard
Nov 30, 2020
PUBLISHED
SRPS EN 60749-9:2017