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SRPS EN 62418:2011

Semiconductor devices - Metallization stress void test

Apr 21, 2011

General information

60.60     Apr 21, 2011

ISS

N022

European Norm

31.080  

English  

From plan 2011

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Scope

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

Life cycle

NOW

PUBLISHED
SRPS EN 62418:2011
60.60 Standard published
Apr 21, 2011

Related project

Adopted from EN 62418:2010