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SRPS EN 60191-6-19:2011

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Apr 21, 2011

General information

60.60     Apr 21, 2011

ISS

N022

European Norm

31.080.01  

English  

From plan 2011

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Scope

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Life cycle

NOW

PUBLISHED
SRPS EN 60191-6-19:2011
60.60 Standard published
Apr 21, 2011

Related project

Adopted from EN 60191-6-19:2010