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SRPS EN ISO 9455-17:2012

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)

Jun 21, 2012
95.99   Withdrawal of Standard   Mar 29, 2024

General information

95.99     Mar 29, 2024

ISS

M044

European Norm

25.160.50  

English  

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Scope

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

Life cycle

NOW

WITHDRAWN
SRPS EN ISO 9455-17:2012
95.99 Withdrawal of Standard
Mar 29, 2024

REVISED BY

PUBLISHED
SRPS EN ISO 9455-17:2024

Related project

Adopted from EN ISO 9455-17:2006

Adopted from ISO 9455-17:2002 IDENTICAL