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SRPS EN 60191-6-13:2017

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Dec 25, 2017

General information

60.60     Dec 25, 2017

ISS

N022

European Norm

31.080.01  

English  

sednica 2017-05-16

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Published

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Scope

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA. This edition includes the following significant technical changes with respect to the previous edition:

a) BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively. Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.

Life cycle

PREVIOUSLY

WITHDRAWN
SRPS EN 60191-6-13:2008

NOW

PUBLISHED
SRPS EN 60191-6-13:2017
60.60 Standard published
Dec 25, 2017

Related project

Adopted from EN 60191-6-13:2016