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SRPS EN IEC 62148-21:2019

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Nov 29, 2019
95.99   Withdrawal of Standard   Dec 30, 2024

General information

95.99     Dec 30, 2024

ISS

N086

European Norm

33.180.20  

English  

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Scope

This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.

Life cycle

NOW

WITHDRAWN
SRPS EN IEC 62148-21:2019
95.99 Withdrawal of Standard
Dec 30, 2024

REVISED BY

PUBLISHED
SRPS EN IEC 62148-21:2022

Related project

Adopted from EN IEC 62148-21:2019

Adopted from IEC 62148-21:2019 ED1 IDENTICAL