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Search Serbian, European and international standards. Identify the standard organization, select the standard number or keyword, and complete the search you want. You can also add a standard drafting stage or a committee / national committee that drafted the standard
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
60.60
Standard published
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
60.60
Standard published
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
60.60
Standard published
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
60.60
Standard published
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
60.60
Standard published
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
60.60
Standard published
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
60.60
Standard published
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
60.60
Standard published
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
60.60
Standard published
Low pressure sodium vapour lamps - Performance specifications
60.60
Standard published
Hydraulic turbines, storage pumps and pump-turbines - Model acceptance tests
90.93
Standard confirmed
Method of measurement of current noise generated in fixed resistors
90.93
Standard confirmed
IEC standard frequencies
60.60
Standard published
IEC standard frequencies
60.60
Standard published
High-voltage connecting wire with flame retarding insulation for use in television receivers
60.60
Standard published
Aluminium and aluminium alloys - Wrought products - Chemical composition of semi-finished products used for the fabrication of articles for use in contact with foodstuff
90.93
Standard confirmed
Aluminium and aluminium alloys - Wrought products - Chemical composition of semi-finished products used for the fabrication of articles for use in contact with foodstuff
90.93
Standard confirmed
Coal — Determination of mineral matter
90.92
Standard to be revised
