Projects

Radio-frequency connectors - Part 23: Pin and socket connector for use with 3,5 mm rigid precision coaxial lines with inner diameter of outer conductor 3,5 mm (0,1378 in)

60.60   Standard published

Radio-frequency connectors - Part 25: Two-pole screw (3/4-20 UNEF) coupled connectors for use with shielded balanced cables having twin inner conductors with inner diameter of outer conductor 13,56 mm (0,534 in) (Type TWHN)

60.60   Standard published

Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires

60.60   Standard published

Aerospace series - Test methods for metallic materials - Determination of density according to displacement method

60.60   Standard published

Guidance for the selection of high-voltage A.C. cable systems

60.60   Standard published

High-pressure mercury vapour lamps - Performance specifications

60.60   Standard published

High-pressure mercury vapour lamps - Performance specifications

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

60.60   Standard published

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

60.60   Standard published