Projects
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Maritime navigation and radiocommunication equipment and systems - Electronic chart display and information system (ECDIS) - Operational and performance requirements, methods of testing and required test results
10.99
New project approved
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards
10.99
New project approved
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
10.99
New project approved
Mineral insulating oils - Methods for the determination of 2-furfural and related compounds
10.99
New project approved
Low-voltage switch mode power supplies - Part 3: Electromagnetic compatibility (EMC)
10.99
New project approved
Insulating materials - Industrial rigid round laminated tubes and rods based on thermosetting resins for electrical purposes - Part 2: Methods of test
10.99
New project approved
Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-6: Special requirements for testing of metal halide perovskite-containing photovoltaic (PV) modules
10.99
New project approved
Radiotherapy equipment - Coordinates, movements and scales
10.99
New project approved
Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications
10.99
New project approved
Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad - Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
10.99
New project approved
Materials for circuit boards and other interconnecting structures - Part 3-7: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad
10.99
New project approved
Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad
10.99
New project approved
Materials for circuit boards and other interconnecting structures - Part 3-9: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad
10.99
New project approved
Process measurement and control devices - General methods and procedures for evaluating performance - Part 4: Evaluation report content
10.99
New project approved
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-28: Tests - Corrosive atmosphere (sulphur dioxide)
10.99
New project approved
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-34: Examinations and measurements - Attenuation and return loss of random mated connectors
10.99
New project approved
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-46: Examinations and measurements - Bore diameter in rectangular ferrules
10.99
New project approved
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-56: Examinations and measurements - Attenuation and return loss of random mated single-mode weakly coupled 4-core rectangular ferrule multi-fibre connectors
10.99
New project approved
