Projects

Industrial networks – Fieldbus specifications – Part 5-29: Application layer service definition – Type 29 elements

20.99   WD approved for registration as CD

Industrial networks – Fieldbus specifications – Part 6-29: Application layer protocol specification – Type 29 elements

20.99   WD approved for registration as CD

Ultrasonics - Power measurement - Radiation force balances and performance requirements

20.99   WD approved for registration as CD

Radio frequency connectors – Part 1-10: Electrical test methods – Contact resistance

20.99   WD approved for registration as CD

Radio-frequency connectors - Part 1-3: Electrical test methods - Surge withstand - Surge protective devices built in a coaxial connector - Performance requirements and testing methods

60.00   Standard under publication

Radio-frequency connectors. Part 10: R.F. coaxial connectors with inner diameter of outer conductor 3 mm (0.12 in) with snap-on coupling - Characteristic impedance 50 ohms (Type SMB)

30.99   CD approved for registration as DIS

Amendment 1 - Radio-frequency connectors - Part 32: RF coaxial connectors with inner diameter of outer conductor 1,85 mm (0,072 in) with screw coupling - Characteristic impedance 50 ohms (type 1,85)

30.99   CD approved for registration as DIS

Amendment 1 - Radio-frequency connectors - Part 35: Sectional specification for 2,92 series RF connectors

30.99   CD approved for registration as DIS

Amendment 1 - Radio frequency connectors - Part 54: Sectional specification for coaxial connectors with 10 mm inner diameter of outer conductor, nominal characteristic impedance 50 Ω, Series 4,3-10

40.99   Full report circulated: DIS approved for registration as FDIS

Maritime navigation and radiocommunication equipment and systems - Electronic chart display and information system (ECDIS) - Operational and performance requirements, methods of testing and required test results

30.20   CD study/ballot initiated

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards

30.99   CD approved for registration as DIS

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

40.99   Full report circulated: DIS approved for registration as FDIS

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

30.60   Close of voting/ comment period

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

20.99   WD approved for registration as CD

Circuit board assemblies - Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding

30.99   CD approved for registration as DIS

Coaxial communication cables - Part 1-100: Electrical test methods - General requirements

20.99   WD approved for registration as CD

Coaxial communication cables - Part 1-129: Electrical test methods - Link-loss balance of radiating cables

40.60   Close of voting

Coaxial communication cables - Part 1-302: Mechanical test methods - Test for eccentricity and concentricity

40.00   DIS registered