Projects

Part model guideline for electronic-device packages - XML requirements (Fast track)

40.20   DIS ballot initiated: 12 weeks

Composite insulated cross-arms with AC rated voltage greater than 1 000 V and DC voltage greater than 1 500 V – Definitions, design criteria, test methods and acceptance criteria

20.99   WD approved for registration as CD

Industrial networks – 5G Communication Technology – Part 1: Terms, definitions and fundamentals

40.99   Full report circulated: DIS approved for registration as FDIS

Replay Tools for radioactive material detection systems

30.60   Close of voting/ comment period

Application of IEC 63339 to Smart Manufacturing Reference Models

50.00   Final text received or FDIS registered for formal approval

Application of IEC 63339 to smart manufacturing reference models

30.99   CD approved for registration as DIS

Plugs, socket-outlets, ship couplers for low-voltage shore connection systems (LVSC-systems) in Direct Current (DC)

20.99   WD approved for registration as CD

Guidelines for joint control for hydroelectric power plants

20.99   WD approved for registration as CD

Evaluation of hydrophobicity retention of polymeric insulating materials under high voltage stress with the dynamic drop test

30.99   CD approved for registration as DIS

Arc hazards and safety aspects in LVDC power distribution system – Part 1: Series arc characteristics between brass and copper-alloy electrodes

30.20   CD study/ballot initiated

Performance of power electronic transformer for flexible transmission and distribution systems

50.00   Final text received or FDIS registered for formal approval

Grid compliance test for photovoltaic power plants

20.99   WD approved for registration as CD

Hazard analysis due to using C-UAS system in nuclear site

50.20   Proof sent to secretariat or FDIS ballot initiated: 8 weeks

Quantum technologies – Terminology and quantities – General quantities

20.99   WD approved for registration as CD

Semiconductor devices - Reliability test methods for vibration energy harvesters - Part 1: Mechanical reliability under shock

40.60   Close of voting

Semiconductor devices - Reliability test methods for vibration energy harvesters - Part 2: Temperature and humidity

30.20   CD study/ballot initiated

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant

30.99   CD approved for registration as DIS

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements

30.99   CD approved for registration as DIS