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Amendment 1 - Radio-frequency connectors - Part 35: Sectional specification for 2,92 series RF connectors
40.20 DIS ballot initiated: 12 weeks
Amendment 1 - Radio-frequency connectors - Part 54: Sectional specification for coaxial connectors with 10 mm inner diameter of outer conductor, nominal characteristic impedance 50 Ω, series 4,3-10
50.60 Close of voting. Proof returned by secretariat
Radio-frequency connectors - Part 69: Sectional specification for RF coaxial connectors with push on mating - Characteristic impedance 50 Ω (type SMP3)
30.99 CD approved for registration as DIS
Maritime navigation and radiocommunication equipment and systems - Electronic chart display and information system (ECDIS) - Operational and performance requirements, methods of testing and required test results
40.00 DIS registered
Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-722: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer
30.20 CD study/ballot initiated
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards
30.99 CD approved for registration as DIS
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards
50.60 Close of voting. Proof returned by secretariat
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
40.20 DIS ballot initiated: 12 weeks
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
20.99 WD approved for registration as CD
Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate
40.20 DIS ballot initiated: 12 weeks
Coaxial communication cables - Part 1-100: Electrical test methods - General requirements
20.99 WD approved for registration as CD
Coaxial communication cables - Part 1-129: Electrical test methods - Link-loss balance of radiating cables
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Coaxial communication cables - Part 1-302: Mechanical test methods - Test for eccentricity and concentricity
40.99 Full report circulated: DIS approved for registration as FDIS
Mineral insulating oils - Methods for the determination of 2-furfural and related compounds
20.99 WD approved for registration as CD
Application guides complying with IEC 60364 - Uninterruptible Power Systems
30.60 Close of voting/ comment period
Electrical installation guide - Part 204: Application guides complying with IEC 60364 - Rotating generators
30.60 Close of voting/ comment period
Electrical installation guide - Part 206: Application guides complying with IEC 60364 - Selection of conductor cross-sectional area and coordination with protective devices
20.99 WD approved for registration as CD
Fibre optic interconnecting devices and passive components - Fibre optic isolators - Part 1: Generic specification
40.99 Full report circulated: DIS approved for registration as FDIS