Projects

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

60.60   Standard published

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

60.60   Standard published

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

60.60   Standard published

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

60.60   Standard published

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

60.60   Standard published

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

60.60   Standard published

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

60.60   Standard published

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

60.60   Standard published

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

60.60   Standard published

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

50.60   Close of voting. Proof returned by secretariat