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SRPS EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Aug 31, 2021

General information

60.60     Aug 31, 2021

ISS

N040

European Norm

31.180     31.190     31.18     31.19  

English  

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Scope

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

Life cycle

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PUBLISHED
SRPS EN IEC 61188-6-2:2021
60.60 Standard published
Aug 31, 2021

Related project

Adopted from EN IEC 61188-6-2:2021

Adopted from IEC 61188-6-2:2021 ED1 IDENTICAL