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SRPS EN IEC 62878-1:2020

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Feb 28, 2020

General information

60.60     Feb 28, 2020

ISS

N040

European Norm

31.180     31.190     31.18     31.19  

English  

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Scope

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.

The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

Life cycle

NOW

PUBLISHED
SRPS EN IEC 62878-1:2020
60.60 Standard published
Feb 28, 2020

Related project

Adopted from EN IEC 62878-1:2019

Adopted from IEC 62878-1:2019 ED1 IDENTICAL