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IEC 60191-6-4:2003 ED1

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Jun 11, 2003

General information

60.60     Jun 11, 2003

IEC

TC 47/SC 47D

International Standard

31.080.01  

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IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

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PUBLISHED
IEC 60191-6-4:2003 ED1
60.60 Standard published
Jun 11, 2003