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Glavni meni

IEC 60191-6-4:2003 ED1

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
11. 6. 2003.

Опште информације

60.60     11. 6. 2003.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 60191-6-4:2003 ED1
60.60 Standard objavljen
11. 6. 2003.