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IEC 60127-4 ED4

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types

General information

50.20     Nov 21, 2025

PRVD    Jan 2, 2026

IEC

TC 32/SC 32C

International Standard

29.120.50  

Scope

This part of IEC 60127 relates to universal modular fuse-links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors.

Life cycle

PREVIOUSLY

PUBLISHED
IEC 60127-4:2005 ED3

PUBLISHED
IEC 60127-4:2005/AMD1:2008 ED3

PUBLISHED
IEC 60127-4:2005/AMD2:2012 ED3

NOW

PROJECT
IEC 60127-4 ED4
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Nov 21, 2025

National adoptions

dnaSRPS EN IEC 60127-4:2025  
ISS

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types

50.20   Proof sent to secretariat or FDIS ballot initiated: 8 weeks

N032 more

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