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IEC 60127-4:2005 ED3

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types

Dec 7, 2012

General information

99.60     Mar 27, 2026

IEC

TC 32/SC 32C

International Standard

29.120.50  

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Revised

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Scope

This part of IEC 60127 relates to universal modular fuse-links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors. It does not apply to fuse-links for appliances intended to be used under special conditions, such as in a corrosive or explosive atmosphere. This standard applies in addition to the requirements of IEC 60127-1.

Life cycle

NOW

WITHDRAWN
IEC 60127-4:2005 ED3
99.60 Withdrawal effective
Mar 27, 2026

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60127-4:2005/AMD1:2008 ED3

WITHDRAWN
IEC 60127-4:2005/AMD2:2012 ED3

REVISED BY

PUBLISHED
IEC 60127-4:2026 ED4

National adoptions

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types

90.93   Standard confirmed

N032 more