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IEC 63378-6-1 ED1

Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device

General information

40.60     Dec 12, 2025

IEC

TC 47/SC 47D

International Standard

31.080.01  

Life cycle

NOW

PROJECT
IEC 63378-6-1 ED1
40.60 Close of voting
Dec 12, 2025

National adoptions

naSRPS EN IEC 63378-6-1:2025  
ISS

Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device

40.60   Close of voting

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