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IEC 63609-3 ED1

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples

General information

30.20     Jan 9, 2026

PCC    Mar 6, 2026

IEC

TC 91

International Standard

31.180     31.190  

Life cycle

NOW

PROJECT
IEC 63609-3 ED1
30.20 CD study/ballot initiated
Jan 9, 2026

National adoptions

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples

10.99   New project approved

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