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IEC 62047-54 ED1

Semiconductor devices - Micro-electromechanical devices - Part 54: Silicon based MEMS fabrication technology – Measurement method of tensile strength of microstructures

General information

40.20     Jul 31, 2026

PRVC    Oct 23, 2026

IEC

TC 47/SC 47F

International Standard

31.080.99  

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NOW

PROJECT
IEC 62047-54 ED1
40.20 DIS ballot initiated: 12 weeks
Jul 31, 2026

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Semiconductor devices - Micro-electromechanical devices - Part 54: Measurement method of tensile strength of microstructures

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