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IEC 62047-54 ED1

Semiconductor devices - Micro-electromechanical devices - Part 54: Silicon based MEMS fabrication technology – Measurement method of tensile strength of microstructures

General information

30.99     Feb 27, 2026

TCDV    Apr 17, 2026

IEC

TC 47/SC 47F

International Standard

31.080.99  

Life cycle

NOW

PROJECT
IEC 62047-54 ED1
30.99 CD approved for registration as DIS
Feb 27, 2026

National adoptions

Semiconductor devices - Micro-electromechanical devices - Part 54: Measurement method of tensile strength of microstructures

30.98   Project deleted

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