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IEC 61191-10-2 ED1

Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate

General information

40.20     Aug 21, 2026

PRVC    Nov 13, 2026

IEC

TC 91

International Standard

31.180     31.190  

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NOW

PROJECT
IEC 61191-10-2 ED1
40.20 DIS ballot initiated: 12 weeks
Aug 21, 2026

National adoptions

Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate

40.20   DIS ballot initiated: 12 weeks

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