naSRPS EN IEC 61191-10-2:2025
Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate
General information
Current stage:
40.20
Effective date:
Aug 21, 2026
Next stage: 40.60
Next stage date: Oct 23, 2026
Originator:
ISS
Owner:
N040
Type:
European Norm
ICS:
31.180
31.190
Languages:
English
Buying
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Life cycle
NOW
PROJECT
naSRPS EN IEC 61191-10-2:2025
40.20
DIS ballot initiated: 12 weeks
Aug 21, 2026
Related project
Adopted from
prEN IEC 61191-10-2:2026
IDENTICAL
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