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naSRPS EN IEC 61191-10-2:2025

Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate

General information

40.20     Aug 21, 2026

40.60    Oct 23, 2026

ISS

N040

European Norm

31.180     31.190  

English  

Buying

Уколико желите да набавите овај документ обратите се на следећу адресу: prodaja@iss.rs

Life cycle

NOW

PROJECT
naSRPS EN IEC 61191-10-2:2025
40.20 DIS ballot initiated: 12 weeks
Aug 21, 2026

Related project

Adopted from prEN IEC 61191-10-2:2026 IDENTICAL

Adopted from IEC 61191-10-2 ED1 IDENTICAL

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