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IEC 61249-2-56 ED1

Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

General information

30.60     Aug 28, 2026

IEC

TC 91

International Standard

31.180  

Life cycle

NOW

PROJECT
IEC 61249-2-56 ED1
30.60 Close of voting/ comment period
Aug 28, 2026

National adoptions

prSRPS EN IEC 61249-2-56:2026  
ISS

Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad - Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

10.99   New project approved

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