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prSRPS EN IEC 61249-2-56:2026

Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad - Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

General information

10.99    

ISS

N040

European Norm

31.180  

English  

Life cycle

NOW

PROJECT
prSRPS EN IEC 61249-2-56:2026
10.99 New project approved

Related project

Adopted from prEN IEC 61249-2-56 IDENTICAL

Adopted from IEC 61249-2-56 ED1 IDENTICAL