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PNW 91-2075 ED1

Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

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10.60     Jan 9, 2026

IEC

TC 91

International Standard

Life cycle

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PNW 91-2075 ED1
10.60 Close of voting
Jan 9, 2026