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IEC 61249-3-9 ED1

Materials for circuit boards and other interconnecting structures - Part 3-9: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

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30.20     4. 9. 2026.

PCC    30. 10. 2026.

IEC

TC 91

Međunarodni standard

31.180  

Apstrakt

Životni ciklus

TRENUTNO

PROJEKAT
IEC 61249-3-9 ED1
30.20 Početak izjašnjavanja o nacrtu komisije standarda
4. 9. 2026.

Nacionalna preuzimanja

prSRPS EN IEC 61249-3-9:2026  
ISS

Materials for circuit boards and other interconnecting structures - Part 3-9: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad

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