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IEC 60191-6-21:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Aug 30, 2010

General information

60.60     Aug 30, 2010

IEC

TC 47/SC 47D

International Standard

31.080.01  

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IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

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PUBLISHED
IEC 60191-6-21:2010 ED1
60.60 Standard published
Aug 30, 2010