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Glavni meni

IEC 60191-6-21:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
30. 8. 2010.

Опште информације

60.60     30. 8. 2010.

IEC

TC 47/SC 47D

Međunarodni standard

31.080.01  

engleski   francuski  

Kupovina

Objavljen

Jezik na kome želite da primite dokument.

Apstrakt

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Životni ciklus

TRENUTNO

OBJAVLJEN
IEC 60191-6-21:2010 ED1
60.60 Standard objavljen
30. 8. 2010.