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SRPS EN IEC 60286-3:2023

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Jun 30, 2023

General information

60.60     Jun 30, 2023

ISS

N040

European Norm

31.020     31.240  

English  

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Published

Language in which you want to receive the document.

Scope

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

Life cycle

PREVIOUSLY

PUBLISHED
SRPS EN IEC 60286-3:2019

NOW

PUBLISHED
SRPS EN IEC 60286-3:2023
60.60 Standard published
Jun 30, 2023

Related project

Adopted from EN IEC 60286-3:2022

Adopted from IEC 60286-3:2022 ED7 IDENTICAL