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dnaSRPS EN IEC 62878-2-603:2022

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity

General information

50.60     Jan 31, 2025

ISS

N040

European Norm

31.180     31.190  

English  

Scope

IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).

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PROJECT
dnaSRPS EN IEC 62878-2-603:2022
50.60 Close of voting. Proof returned by secretariat
Jan 31, 2025

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