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prSRPS EN IEC 63609-2:2024

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements

General information

10.99     Nov 11, 2024

ISS

N040

European Norm

31.180     31.190  

English  

Life cycle

NOW

PROJECT
prSRPS EN IEC 63609-2:2024
10.99 New project approved
Nov 11, 2024

Related project

Adopted from prEN IEC 63609-2 IDENTICAL

Adopted from IEC 63609-2 ED1 IDENTICAL