naSRPS EN IEC 63378-4:2026
Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages
General information
40.20
Feb 13, 2026
ISS
N022
European Norm
31.080.01
English
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Life cycle
NOW
PROJECT
naSRPS EN IEC 63378-4:2026
40.20
DIS ballot initiated: 12 weeks
Feb 13, 2026
Related project
Adopted from
prEN IEC 63378-4:2026
IDENTICAL
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