Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.
WITHDRAWN
SRPS EN 60749-30:2008
95.99
Withdrawal of Standard
Dec 29, 2023
PUBLISHED
SRPS EN IEC 60749-30:2020