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SRPS EN 60749-37:2009

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

May 20, 2009
95.99   Withdrawal of Standard   Jan 30, 2026

General information

95.99     Jan 30, 2026

ISS

N022

European Norm

31.080.01  

English  

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Scope

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

Life cycle

NOW

WITHDRAWN
SRPS EN 60749-37:2009
95.99 Withdrawal of Standard
Jan 30, 2026

REVISED BY

PUBLISHED
SRPS EN IEC 60749-37:2023

Related project

Adopted from EN 60749-37:2008