Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
WITHDRAWN
SRPS EN 60749-37:2009
95.99
Withdrawal of Standard
Jan 30, 2026
PUBLISHED
SRPS EN IEC 60749-37:2023