Phone: (011) 7541-421, 3409-301, 3409-335, 6547-293, 3409-310
E-mail: Standards sales: prodaja@iss.rs Education: iss-edukacija@iss.rs Information about standards: infocentar@iss.rs
Stevana Brakusa 2, 11030 Beograd
Main menu

SRPS EN 62137:2009

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Nov 30, 2009
95.99   Withdrawal of Standard   Dec 25, 2017

General information

95.99     Dec 25, 2017

ISS

N040

European Norm

31.190  

English  

Buying

Withdrawn

Language in which you want to receive the document.

Scope

Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.

Life cycle

NOW

WITHDRAWN
SRPS EN 62137:2009
95.99 Withdrawal of Standard
Dec 25, 2017

Related project

Adopted from EN 62137:2004