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SRPS EN 62137-1-1:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Nov 30, 2009

General information

60.60    

ISS

N040

European Norm

31.190  

English  

Buying

Published

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Scope

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Life cycle

NOW

PUBLISHED
SRPS EN 62137-1-1:2009
60.60 Standard published

Related project

Adopted from EN 62137-1-1:2007